EBSD ： Electron Backscatter Diffraction Pattern
Features
EBSD, also called electron backscatter pattern (EBSP) or SEM orientation imaging microscopy (OIM), enables analysis of the lattice orientation in crystalline samples. Compared to electron diffraction (ED) or TEM electron diffraction mapping (ED-Map), EBSD is easier to prepare samples and offers a much wider area of analysis. The following measurements are available:
- Plane orientation of single crystal grains of the region of interest
- Orientation of the crystal lattice planes
- Grain size
- Observation of twin (coincidence) grain boundaries
- Extraction of specific crystal orientations
- Relative rotation angle of adjacent grains
- Transmission EBSD allows grains larger than 10 nm
Application Examples
- Grain assessment of CuInxGa1-xSe2 (CIGS) thin films, e.g. polycrystalline photovoltaic cells
- Lattice distortion measurement
- Grain observation in semiconductor device metal wiring
- Investigation of grain boundaries around voids
- Crystallographic analysis of polycrystalline Si thin-film transistors (TFT)
- Evaluation of the crystallinity in middle layer of alloys
- Whisker orientation measurement
- Process optimization of thin-film growth
- Aging analysis of metal thin films
Principle
When an electron beam impinges on a sample at an angle about 60 to 70° with respect to the sample normal, electron diffraction occurs at each crystal plane down to a depth of 50nm or less from the sample surface. The electron beam in EBSD has a larger divergence angle compared to conventional electron diffraction, so the diffraction appears in bands (Kikuchi lines). Analysis of this pattern provides information on the crystal orientation.
Data examples
Data delivery format
Portable Document Format (PDF) and Microsoft® PowerPoint formats using MST’s download service. Upon request, original figures, data, and ASCII text file (grain size distribution data) can also be delivered.
Specifications
Items for enquiries
- Purpose and content of measurement
- Sample information
- Number of samples, and availability of preliminary samples
- Structure, shape, layer structure, crystal structure of the target area material, film thickness, roughness of the outermost surface, processing, sample breakage (cutting, etc.)
- Handling instructions
- Details on delivery
- Preferred due date for preliminary analysis report
- Due date for delivery of final report
- Any other issues
Caution
Analysis results can largely be affected by the surface roughness
Insulating samples are coated with a conducting material, such as Pt, in order to avoid static electric charge accumulation
Crystal grains below 10 nm might not be possible to detect
［EBSD］電子後方散乱回折法の分析事例はこちらからご覧ください。