Features
Using a high-resolution SEM with focused ion beam (FIB) etching, it is possible to obtain three-dimensional structural information by finely etching the sample between each SEM image and then reconstruct a 3D image similarly to computer tomography (CT).
In addition to SEM images from secondary electrons (SE), backscattered electrons (BSE), a scanning ion microscope (SIM) images also available.
Application Examples
- Three-dimensional evaluation of semiconductor device shapes
- Identifying voids and disconnections in metal wiring after e.g., reliability testing
- Quantitative evaluation of device fabrication pattern misalignment
- Evaluation of embedding capability of interlayer film
- Investigation of contamination processes in multi-layered structures
- Evaluation of electrical contact areas
- Three-dimensional evaluation thin film coverage
- Evaluation of seam shape in tungsten contact/via plug
- Observation of optical disk recording layer pit shapes
- Evaluation of interface roughness in laminated structures
Principle
The SEM images are acquired continuously while repeating the FIB etching process. The software then combines the SEM images from each layer to construct a three-dimensional tomography image.
Data Examples
Data delivery file format
Joint photographic expert group (JPEG) and tag image file format (TIFF) for slices, and m3d (proprietary file format of the MST 3D image viewer) for 3D reconstructed data.
Specifications
Items for enquiries
- Purpose and content of measurement
- Sample information
- Number of samples, and availability of preliminary samples
- Shape, composition, and availability of cutting and/or coating the sample
- Layer structure and film thickness (for cross-sectional observation)
- Handling instructions
Details on delivery
- Preferred due date for preliminary analysis report
- Due date for delivery of final report
Any other issues
Caution
The following materials may adversely affect the evaluation:
- Magnetic materials
- Samples with a low melting point and vaporization
- Insulating material (may be observable by conductive treatment such as Pt or C)
［Slice&View］三次元SEM観察法の分析事例はこちらからご覧ください。